Vertiv Expands its Global Liquid Cooling Portfolio with the Announcement of Two New High-Capacity Coolant Distribution Units to Support AI Applications
COLUMBUS, Ohio–(BUSINESS WIRE)–Vertiv (NYSE: VRT), a global provider of critical digital infrastructure and continuity solutions, today announced a significant expansion of its liquid cooling product portfolio with the introduction of two new Vertiv™ CoolChip CDU (coolant distribution unit) systems. These systems enable modular, cost-effective liquid cooling deployments in data centers, making it possible to operate high-density computing for AI alongside traditional air-cooled racks. The new CDUs are on display at the Vertiv booth at SC24, the international conference for high performance computing, networking and storage, from November 19 – 22.
The Vertiv CoolChip CDU family delivers much-needed flexibility to data centers and colocation providers, with capability for fast, modular growth and the ability to support multiple high-density racks from a single CDU, supporting the increasing demand for AI deployments. Along with these new systems, Vertiv has a broad suite of global service offerings to support the deployment of liquid cooled infrastructure, ranging from solution design to installation to on-going lifecycle and fluid management.
John Niemann, senior vice president of the thermal business unit at Vertiv, said :
The AI-focused data center necessitates advanced cooling technologies,
“Vertiv’s expanded liquid-cooled solutions support the densification of the data center we are seeing as a result of AI. Our liquid cooling portfolio, complemented by our full solution of air cooling, heat rejection, and re-use solutions and global services capability, enables both new and existing data centers to seamlessly introduce liquid cooling as part of the overall hybrid cooling solution to make AI deployments easier, faster and more cost-effective for customers.”
The Vertiv™ CoolChip CDU 2300kW model is a liquid-to-liquid system that offers the most compact footprint in its capacity range, with the smaller cabinet enabling it to be placed in the row or in a mechanical gallery outside of the data center whitespace. Offering 2.3 MW of cooling capacity, this design caters to hyperscalers and colocation providers looking to deploy large scale liquid cooling solutions at the highest density. This solution has the industry’s highest CDU capacity per square foot, enabling operators to reduce cost and footprint by deploying fewer CDUs.
The Vertiv™ CoolChip CDU 350kW model is a liquid-to-air solution that offers direct-to-chip liquid cooling support with air-based heat rejection, enabling it to easily retrofit into existing facilities and to deploy liquid cooling for direct-to-chip applications without a facility chilled water system.
Both Vertiv™ CoolChip CDU systems can distribute coolant directly to liquid cooled chips and rear-door heat exchangers. Controls allow for fluctuating temperature and flow to match varying application demands. The systems leverage unit-to-unit communication for system-level control; redundant power feeds, pumps and filters for improved cooling availability; remote temperature, humidity and leak detection sensors; and integrated controls that enable remote monitoring and management.
For more information on the thermal management portfolio or other Vertiv solutions for modern data centers, visit Vertiv.com.
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Vertiv Expands its Global Liquid Cooling Portfolio with the Announcement of Two New High-Capacity Coolant Distribution Units to Support AI Applications, source
