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Eoptolink Joins XPO MSA and Unveils Industry-First 12,8 Tbps Liquid-Cooled Pluggable Optics for AI Data Centers

eoptolink optics data centers

Eoptolink Joins XPO MSA and Unveils Industry-First 12,8 Tbps Liquid-Cooled Pluggable Optics for AI Data Centers

LOS ANGELES, March 12, 2026 /PRNewswire/ — Eoptolink Technology Inc., Ltd., a global leader and innovator in advanced optical interconnect solutions, today announced the launch of its industry-first 12.8T XPO product, a next-generation pluggable optical transceiver engineered to support a wide range of AI data center architectures, including scale-up, scale-out, and metro-reach fabrics.

Offering an impressive throughput of 12.8 Tbps, the Eoptolink XPO features 64 lanes operating at 200 Gbps, achieving a record-breaking front-panel density of 204.8 Tbps within a compact 4-RU rack. This represents a 4X improvement compared with current 1.6T OSFP solutions.

Additionally, the module integrates a cold plate capable of supporting up to 400W of cooling per module, ensuring reliable operation in high-power environments. The XPO architecture also provides deployment flexibility with support for linear, half-retimed, and fully-retimed interfaces.

Sean Davies, Vice President of Sales at Eoptolink,  said:

XPO modules address key challenges our customers and the industry are facing as network bandwidth requirements continue to scala

“Liquid cooling enables higher-power optical modules while maintaining thermal efficiency, allowing much greater port density. At the same time, front-panel pluggability preserves the serviceability and deployment flexibility that operators rely on.”

Eoptolink has also joined the XPO Multi-Source Agreement (MSA) as a founding member. The XPO MSA is an industry collaboration focused on defining a new class of high-density, liquid-cooled pluggable optics. By joining the XPO MSA, Eoptolink will contribute its expertise in high-speed optical transceiver design and manufacturing to support the development and commercialization of next-generation optical interconnect solutions for AI infrastructure and cloud data centers.

Eoptolink will be showcasing its latest 12.8T XPO, 400G/lambda-1.6T DR4, and 200G/lambda-1.6T FRO/LRO/LPO series optical transceiver solutions at the Eoptolink booth #1211 during OFC 2026 in Los Angeles, CA. Visitors are invited to stop by the booth to experience the performance of these solutions first-hand.

READ the latest news shaping the data centre market at Data Centre Central

Eoptolink Joins XPO MSA and Unveils Industry-First 12,8 Tbps Liquid-Cooled Pluggable Optics for AI Data Centers, source

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