Karman Industries Launches the HPU: A New Category in Thermal Infrastructure for Giga-Scale AI Karman’s Heat Processing Unit (HPU) revolutionizes the thermal architecture of giga-scale data centers for the latest AI...
Category - Thermal Management
Vertiv Introduces New Modular Liquid Cooling Infrastructure Solution to Support High-Density Compute Requirements in North America and EMEA
Vertiv Introduces New Modular Liquid Cooling Infrastructure Solution to Support High-Density Compute Requirements in North America and EMEA The scalable, hybrid cooling solution, Vertiv™ MegaMod™ HDX, delivers capacity...
