Data Centre Industry News & Market Intelligence

Accelsius to Showcase Advanced Direct Liquid Cooling Technologies at 2024 OCP Global Summit

Direct Liquid Cooling Technologies Accelsius

Accelsius to Showcase Advanced Direct Liquid Cooling Technologies at 2024 OCP Global Summit.

Accelsius™, whose patented two-phase, direct-to-chip liquid cooling systems enable unprecedented high-performance computing and compute density for data center and edge operators, today announced its plans to showcase advanced cooling solutions at the 2024 OCP Global Summit in San Jose, California, from Oct. 15-17. The company will present research findings and demonstrate innovative technologies aimed at helping organizations dramatically improve data center performance and efficiency.

Key highlights of Accelsius’ participation in the OCP Global Summit include:

Technology White Paper and Test Results—Accelsius, in concert with a top-tier chip OEM, has conducted advanced experimental testing to demonstrate the feasibility of a common or universal cold plate that can use either water, propylene glycol-water mixture or low and medium-pressure refrigerant as the working fluid. The results of this research will be presented in a co-authored technology white paper at the OCP Future Technologies Symposium on Oct. 16, SJCC Lower Level – LL20BC, highlighting the testing methodology, results and conclusions.

Dr. Richard Bonner, CTO of Accelsius, said:

This work represents a significant step forward in advancing liquid cooling technologies for data centers.

“By combining our expertise in two-phase direct-to-chip cooling with advanced chip technologies, we’re paving the way for more efficient and powerful computing solutions.”

Tabletop Demonstrator—Along with the research, Accelsius developed a tabletop-size demonstrator for its NeuCool two-phase direct-to-chip technology. This demonstrator, which showcases the efficiency of refrigerant-based liquid cooling at the engineered cold plate level in a closed loop, will be available for hands-on exploration from 8 a.m. to 4 p.m. on Oct. 16 in the Lower Level Foyer of LL20BC as part of the Future Technologies Symposium. This tabletop hardware demonstration will allow the visualization of the boiling process and two-phase thermal performance in a relevant form factor.

Accelsius’ NeuCool platform is a two-phase, direct-to-chip liquid cooling system that utilizes a safe, proven dielectric refrigerant. The system has been tested to 2,200 watts per server chip (CPU, GPU), providing significant performance headroom for AI and high-performance computing applications while offering potential energy savings of up to 50% compared to traditional air cooling.

READ the latest news shaping the data centre market at Data Centre Central

Accelsius to Showcase Advanced Direct Liquid Cooling Technologies at 2024 OCP Global Summit. source

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